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HDI PCB

» HDI PCB

14 layer gold sinking blind hole HDI PCB

Product parameters

Product Name: 14 layer gold-sinking blind hole hdi PCB
■ Type: HDI
■ Material: FR4 high Tg
■ Substrate copper foil thickness: outer layer oz; inner layer 1/3 oz
■ Minimum linewidth/spacing: 2mil/2mil
■ Minimum borehole diameter: 0.2mm
■ Minimum laser borehole diameter: 0.075 mm
■ Blind hole depth ratio: 1:1
■ Maximum finished product size: 500mm X600mm
■ Surface treatment: OSP + chemical gold precipitation
■ Weld Resistance Color: Green
■ Special technology: blind buried hole

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  • Specifications

Detailed introduction

HDI (High Density Intrerconnection) PCB is defined as a printed circuit board with aperture less than 6 mil, hole Pad less than 0.25 mm, contact density more than 130 points/square inch, wiring density more than 117 inches/square inch, and wiring width/spacing less than 3 mil/3 mil. HDI circuit boards are mainly used in mobile phones, cameras, cameras, laptops, Internet cards, IC boards, military, medical and other fields.

Generally speaking, HDI circuit boards have the following advantages:

  • 1. Cost reduction
  • 2. Increase wiring density
  • 3. Favorable for the use of advanced packaging technology
  • 4. Better electrical performance and signal correctness
  • 5. Better reliability
  • 6. Improving thermal properties
  • 7. It can improve radio frequency interference, electromagnetic interference and electrostatic discharge.
  • 8. Increase design efficiency

HDI process capability

HDI Types: First, Second, Third, Arbitrary Layer Interconnection
Minimum linewidth/spacing: 2mil/2mil
Minimum borehole diameter: 8mil (0.20mm)
Minimum laser borehole diameter: 3mil (0.075mm)
Blind hole depth ratio: 1:1
Surface treatment: chemical gold deposition, tin deposition, silver deposition, full plate gold plating, OSP, lead-free tin spraying, hard gold plating, gold finger, etc.
Weld resistance color: white, black, yellow, red, green, blue

CATEGORY AND TAGS:
HDI PCB

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