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刚挠印刷电路板

» 刚挠印刷电路板

5-层刚挠印刷电路板

Substrate: FR4 TG170
Plate thickness: 1.45 mm
Layer number: 5
Minimum linewidth of inner layer: 0.1/0.1mm
Minimum Linewidth of Outer Layer: 0.1/0.1mm
Minimum aperture: 0.25mm
Finished Copper Thickness: 1OZ
Surface treatment: ENIG

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刚挠印刷电路板

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